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KB KINGBOARD LAMINATES LTD 5/F. Block K Valiant Industrial Centre 2-12 Au Pui Wan St. Fo Tan Shatin N.T. Hong Kong. TEL : (852) 2605 6493 FAX : (852) 2691 5245 / 2691 0445 TECHNICAL INFORMATION KB-6150 KB-6150 is glass fabric based epoxy resin copper clad laminate which could be processed into single/double sided printed circuit board or core for multilayer printed circuit board. It has good performances in flame resistance and dimensional stability. Type Grade Construction KB-6150 ANSI (NEMA) FR-4 Glass fabric Copper foil Epoxy resin Features Excellent dimensional stability Small dimension and thickness changes after heated could warrant precise positioning of circuits and improve the reliability of PTH. Excellent heat and moisture resistance Ion-migration is effectively minimized in hot and humid environment avoiding the occurrence of measling. Excellent thickness uniformity Excellent thickness uniformity improves surface mounting precision which is propitious especially to the thickness control in multilayer PCB. Standard Configuration Thickness : 0.1mm 3.2mm (IPC-4101 Class B) Copper Cladding : 18 m 35 m 70 m Regular Size (mm) : 914 x 1220 1020 x 1220 1041 x 1245 1067 x 1220 Other Size : As specified by customers KB KINGBOARD LAMINATES LTD 5/F. Block K Valiant Industrial Centre 2-12 Au Pui Wan St. Fo Tan Shatin N.T. Hong Kong. TEL : (852) 2605 6493 FAX : (852) 2691 5245 / 2691 0445 TECHNICAL INFORMATION KB-6150 General Properties Properties Unit Flexural Strength Kg/m2 Peel Strength (1 oz) Kg/cm Glass Transition (Tg) o C Test Condition Lengthwise Crosswise A E2 / 105 DSC IPC-4101 IPC-4101 Testing Requirement Method Typical Value above 4.23 x 107 5.58 x 107 above 3.52 x 107 4.54 x 107 2.4.8 above 1.43 2.0 2.4.25 above 130 135 Average Burn 5 1.6 Max Burn 10 7 2.4.4 Flammability Sec E24 / 23 2.3.10 Thermal Stress Sec Float 288 oC 2.4.13.1 Above 20 above 180 Surface Resistance M C96/35/90 2.5.17.1 Above 1.0 x 104 1.0 x 107 Volume Resistivity M -cm C96/35/90 2.5.17.1 Above 1.0 x 106 1.0 x 109 Permittivity Etched/@1MHZ 2.5.5.3 Less than 5.4 4.6 Loss Tangent Etched/@1MHZ 2.5.5.3 Less than 0.035 0.02 Moisture Absorption % D24/23 2.6.2.1 Less than 0.5 0.1 Remarks: Typical values for reference only.
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- Verified : 2012-06-15
- Source: www.ellwest-pcb.com
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