Download IPC-6012B.pdf

Contents : IPC-6012B ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Qualification and Performance Specification for Rigid Printed Boards Developed by the Rigid Printed Board Performance Specifications Task Group (D-33a) of the Rigid Printed Board Committee (D-30) of IPC Supersedes: IPC-6012A with Amendment 1 - July 2000 IPC-6012A - October 1999 IPC-6012 - July 1996 IPC-RB-276 - March 1992 Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC 2215 Sanders Road Northbrook Illinois 60062-6135 Tel 847 509.9700 Fax 847 509.9798 August 2004 IPC-6012B Table of Contents 1 SCOPE ...................................................................... 1 1.1 1.2 1.3 1.3.1 1.3.2 1.3.3 1.3.4 1.4 1.5 1.6 2 Statement of Scope ............................................. 1 Purpose ................................................................ 1 Performance Classification and Type ................. Classification ....................................................... Board Type ......................................................... Selection for Procurement .................................. Material Plating Process and Final Finish ........ Definition of Terms ............................................ 1 1 1 1 1 2 3.3.2 3.3.3 3.3.4 3.3.5 3.3.6 3.3.7 3.3.8 3.3.9 3.4 3.4.1 3.4.2 3.4.3 3.5 3.5.1 3.5.2 3.5.3 3.5.4 3.6 3.6.1 3.6.2 3.7 3.7.1 3.7.2 3.7.3 3.8 3.8.1 3.8.2 3.8.3 3.8.4 3.9 3.9.1 3.9.2 3.9.3 3.10 3.10.1 3.10.2 3.10.3 Laminate Imperfections ...................................... 7 Plating and Coating Voids in the Hole .............. 8 Lifted Lands ........................................................ 8 Marking ............................................................... 8 Solderability ........................................................ 8 Plating Adhesion ................................................. 8 Edge Board Contact Junction of Gold Plate to Solder Finish .................................................. 8 Workmanship ...................................................... 8 Board Dimensional Requirements ..................... 8 Hole Size Hole Pattern Accuracy and Pattern Feature Accuracy ................................... 9 Annular Ring and Breakout (External) ............ 10 Bow and Twist .................................................. 10 Conductor Definition ........................................ 10 Conductor Width and Thickness ...................... 10 Conductor Spacing ........................................... 11 Conductor Imperfections .................................. 11 Conductive Surfaces ......................................... 11 Structural Integrity ............................................ Thermal Stress Testing ..................................... Requirements for Microsectioned Coupons or Production Boards ........................................ Solder Resist (Solder Mask) Requirements ..... 13 13 14 19 Interpretation ....................................................... 2 Revision Level Changes ..................................... 2 APPLICABLE DOCUMENTS ................................... 2 2.1 2.2 2.3 2.4 2.4.1 2.4.2 2.4.3 2.4.4 2.4.5 2.4.6 3 IPC ...................................................................... Joint Industry Standards ..................................... Federal ................................................................ Other Publications .............................................. 3 4 4 4 American Society for Testing and Materials ..... 4 Underwriters Lab ................................................ 4 National Electrical Manufacturers Association .......................................................... 4 American Society for Quality ............................ 4 AMS .................................................................... 4 American Society of Mechanical Engineers ..... 4 REQUIREMENTS ...................................................... 4 Solder Resist Coverage .................................... 19 Solder Resist Cure and Adhesion .................... 20 Solder Resist Thickness ................................... 20 Electrical Requirements .................................... 20 Dielectric Withstanding Voltage ....................... 20 Electrical Continuity and Insulation Resistance ......................................................... 20 Circuit/Plated-Through Shorts to Metal Substrate ............................................................ 20 Moisture and Insulation Resistance (MIR) ...... 20 Cleanliness ........................................................ 21 Cleanliness Prior to Solder Resist Application ........................................................ 21 Cleanliness After Solder Resist Solder or Alternative Surface Coating Application ......... 21 Cleanliness of Inner Layers After Oxide Treatment Prior to Lamination ......................... 21 Special Requirements ....................................... 21 Outgassing ........................................................ 21 Organic Contamination ..................................... 21 Fungus Resistance ............................................ 21 v 3.1 3.2 3.2.1 3.2.2 3.2.3 3.2.4 3.2.5 3.2.6 3.2.7 3.2.8 3.2.9 3.2.10 3.2.11 3.2.12 3.2.13 3.2.14 3.3 3.3.1 General ................................................................ Materials Used in this Specification .................. Laminates and Bonding Material for Multilayer Boards ............................................... External Bonding Materials ............................... Other Dielectric Materials .................................. 4 4 4 4 4 Metal Foils .......................................................... 4 Metal Planes/Cores ............................................. 4 Metallic Platings and Coatings .......................... Organic Solderability Preservative (OSP) ......... Polymer Coating (Solder Resist) ....................... Fusing Fluids and Fluxes ................................... 5 5 5 5 Marking Inks ...................................................... 5 Hole Fill Insulation Material .............................. 7 Heatsink Planes External ................................... 7 Via Protection ..................................................... 7 Embedded Passive Materials .............................. 7 Visual Examination ............................................ 7 Edges ................................................................... 7 IPC-6012B August 2004 3.10.4 3.10.5 3.10.6 3.10.7 3.10.8 3.10.9 3.10.10 3.10.11 3.10.12 3.11 3.11.1 3.12 4 Vibration ........................................................... Mechanical Shock ............................................ Impedance Testing ............................................ Coefficient of Thermal Expansion (CTE) ........ Thermal Shock .................................................. Surface Insulation Resistance (As Received) .. Metal Core (Horizontal Microsection) ............ Rework Simulation ........................................... Bond Strength Unsupported Component Hole Land ......................................................... 21 22 22 22 22 22 22 22 22 Figure 3-3 Figure 3-4 Figure 3-5 Figure 3-6 Figure 3-7 Figure 3-8 Figure 3-9 Figure 3-10 Figure 3-11 Figure 3-12 Figure 3-13 Figure 3-14 Conductor Width Reduction ............................ 11 Separations at External Foil ........................... 11 Crack Definition .............................................. 12 Rectangular Surface Mount Lands ................. 12 Round Surface Mount Lands ......................... 13 Typical Microsection Evaluation Specimen (Three Plated-Through Holes) ........................ 15 Negative Etchback .......................................... 15 Annular Ring Measurement (Internal) ............ 16 Microsection Rotations for Breakout Detection ......................................................... 16 Comparison of Microsection Rotations .......... 16 Metal Core to Plated-Through Hole Spacing ........................................................... 18 Measurement of Minimum Dielectric Spacing ........................................................... 19 Repair ................................................................ 22 Circuit Repairs .................................................. 22 Rework .............................................................. 22 QUALITY ASSURANCE PROVISIONS ................. 22 4.1 4.1.1 4.1.2 4.2 4.2.1 4.2.2 4.3 4.3.1 5 General .............................................................. 22 Qualification ...................................................... 23 Sample Test Coupons ....................................... 23 Acceptance Tests .............................................. 23 C 0 Zero Acceptance Number Sampling Plan ................................................................... 23 Referee Tests ..................................................... 23 Quality Conformance Testing .......................... 23 Coupon Selection .............................................. 23 NOTES .................................................................... 28 Tables Table 1-1 Table 1-2 Table 3-1 Table 3-2 Table 3-3 Table 3-4 Table 3-5 Table 3-6 Table 3-7 Table 3-8 Technology Adder Examples ............................... 1 Default Requirements ......................................... 2 Internal or External Metal Planes ....................... 5 Final Finish Surface Plating Coating Thickness Requirements ..................................... 6 Plating and Coating Voids Visual Examination ... 9 Edge Board Contact Gap .................................... 9 Minimum Annular Ring ........................................ 9 Plated Hole Integrity After Stress ...................... 17 Internal Layer Foil Thickness after Processing ......................................................... 18 External Conductor Thickness after Plating ..... 18 Solder Resist Adhesion ..................................... 20 5.1 5.2 Ordering Data ................................................... 28 Superseded Specifications ................................ 28 IPC-6012B Performance Specification Sheet for Space and Military Avionics ............................... 29 APPENDIX A Table 3-9 Table 3-10 Dielectric Withstanding Voltages ....................... 20 Table 3-11 Insulation Resistance ........................................ 21 Table 4-1 Qualification Test Coupons ............................... 24 C 0 Sampling Plan (Sample Size for Specific Index Value*) ....................................... 24 Acceptance Testing and Frequency .................. 25 Quality Conformance Testing ............................ 28 Table 4-2 Table 4-3 Table 4-4 .............................................................. 34 Figures Figure 3-1 Figure 3-2 Annular Ring Measurement (External) ........... 10 Breakout of 90 and 180 ............................... 10 vi August 2004 IPC-6012B Qualification and Performance Specification for Rigid Printed Boards 1 SCOPE 1.1 Statement of Scope This specification covers qualification and performance of rigid printed boards. The printed board may be single-sided double-sided with or without plated-through holes. The printed board may be multilayer with plated-through holes and with or without buried/blind vias. The printed board may be multilayer containing build up HDI layers conforming to IPC-6016. The printed board may contain active embedded passive circuitry with distributive capacitive planes capacitive or resistive components. The printed board may contain a metal core or external metal heat frame which may be active or nonactive. Revision level changes are described in 1.6. 1.2 Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed boards. 1.3 Performance Classification and Type 1.3.1 Classification The documentation shall provide sufficient information to the supplier so that he can fabricate the printed board and ensure that the user receives the desired product. Information that should be included in the procurement documentation is shown in IPC-D-325. 1.3.3.1 Selection (Default) The procurement documentation should specify the requirements that can be selected within this specification however in the event selections are not made in the documentation Table 1-2 shall apply. 1.3.3.2 Section System (Optional) The following product selection identifier system is provided for clarification of the build type. Quality Specification the generic quality specification. Specification the base performance specification. Type the product type per 1.3.2. Plating Process the plating process per 1.3.4.2. Final Finish the final finish code per 1.3.4.3. Selective Finish the selective finish code adder per 1.3.4.3 enter -'' when no selective finish is required. Product Classification the product classification per 1.3.1 or performance specification sheet. Technology Adder the technology adder as specified in Table 1-1. Add multiple codes as required. Table 1-1 Technology Code This specification recognizes that rigid printed boards will be subject to variations in performance requirements based on end-use. The printed boards are classified by one of three general Performance Classes. Performance classes are defined in IPC-6011. Requirements deviating from these heritage classifications may be established through the use of a Performance Specification Sheet. Requirement exceptions commonly used for Space and Military avionics are shown as the Performance Specification Sheet Class 3A for Space and Military Avionics listed in the back of this document. Technology Adder Examples Technology HDI VP WBP AMC NAMC HF EP VIP-C VIP-N HDI build-up features per IPC-6016 Via Protection Wire Bondable Pads Active Metal Core Nonactive Metal Core External Heat Frame Embedded Passives Via-in-Pad Conductive Fill Via-in-Pad Nonconductive Fill 1.3.2 Board Type Printed boards without plated-through holes (Type 1) and with plated-through holes (Types 2-6) are classified as follows: Type Type Type Type Type 1--Single-Sided Board 2--Double-Sided Board 3--Multilayer board without blind or buried vias 4--Multilayer board with blind and/or buried vias 5--Multilayer metal core board without blind or buried vias Type 6--Multilayer metal core board with blind and/or buried vias Example: IPC 6011/6012/3/1/S/-/3/HDI/EP 1.3.4 Material Plating Process and Final Finish 1.3.4.1 Laminate Material Laminate material is identified by numbers and/or letters classes and types as specified by the appropriate specification listed in the procurement documentation. For procurement purposes performance class shall be specified in the procurement documentation. 1.3.3 Selection for Procurement 1

INFO HASH : 358b00b41c9ee6f4b2ddf4c0ee76f57e5ee75a07

Download now

File Size: 32.5 kb